PCB Assembly Services

Our surface mount (SMT) PCB assembly service is achieved with fully automated production lines, complete with SPI and high performance placement machines, ensuring the highest accuracy and repeatability. 0201 through to large and odd form components including BGA’s are placed consistently.  SMT line throughput of over 100,000 components per hour, combined with the flexibility to handle a very wide range of components, as found on the latest electronic product designs, enable us to offer a high performance flexible PCB assembly service based in the UK.

This level of automation means we are well placed to assemble larger volumes of PCB’s in house, as well as having cells focused on smaller batch sizes.

Large format PCB’s can be handled by our SMT line. Those clients who require the assembly of large format PCB’s, as often found in LED lighting arrays and antenna PCB’s, require a PCB assembly service provider with the capability to process boards beyond the limits of many equipment manufacturers maximum PCB size.

Conventional through hole and hybrid PCB’s utilise cropping machines for consistent lead lengths and a wave soldering process that is regularly monitored and assayed in accordance with our stringent quality processes.

Assembled PCB’s are inspected using a variety of high resolution inspection systems.

A wide range of test, programming and ‘burn-in’ options are also available to complement the service.

PCB’s are assembled in accordance with the standards set out in IPC-A-610, and to our own exacting quality standards. PCB’s are assembled in EPA’s with operators observing ESD precautions.

Our PCB assembly service is complimented by our cable assembly service and complete product manufacturing service.

With high-speed high-spec automated assembly lines, contact us today to discuss your requirements and start benefiting from working with us.

What is the PCB assembly process?

For SMT assemblies, the process involves the boards having solder paste applied, using a highly accurate, high speed, automated screen printer, the solder paste deposits are then inspected using an inline SPI (solder paste inspection) machine. Boards are then ready to have components placed on them. We achieve this utilising a high speed chip-shooter followed by a fine pitch placement platform. The boards then pass through inline inspection, prior to entering the reflow oven.

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